China says US plan to toughen semiconductor curb will backfire

BEIJING, Feb 25 (Reuters) – China’s foreign ministry stated on Tuesday that the U.S. plan to pressure other countries into targeting China’s semiconductor industry will ultimately fail. Lin Jian, a foreign ministry spokesperson, said during a regular press briefing that such actions by the United States would hinder the development of the global semiconductor industry, responding to questions about the White House’s plan to tighten semiconductor restrictions on China. — news from Reuters.com

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